EJOT TSSD®

The EJOT TSSD^® ("Thermischer Stoffschlussdom" = thermal adhesive bonding boss) product and corresponding joining process have been developed with the objective to join components of which one (preferably the top layer) is made of fibre-reinforced plastics.
The process is suitable for sandwich elements with honeycomb and foam core structures (with different cover layers) as well as for CFRP and GFRP materials. 
During the joining process, the plastic boss (made of thermoplastic) is installed into the plastic component with a certain rotation speed and axial load.

The TSSD^® version with collar head is suitable for direct fastening of a thin clamping part to a corresponding component structure. The material of the clamping part can be freely selected - all that is needed is a pre-hole through which the TSSD^® can penetrate into the component structure.

If the application involves creating a screw-in option in a component, TSSD^® variants without a collar head are used. They are inserted flush into the component during the installation process and then act as a screw-in boss for EVO PT^® screws with diameters of 4 or 5 mm.
 

The TSSD^® technology can also be used for snap-fit solutions. For this purpose, we offer a variant of the TSSD^® with a ball head which -  together with a corresponding counterpart (ball socket) - can be used to create a detachable snap-fit connection. 

If the EJOT TSSD^® standard solutions do not meet your application-specific requirements, please feel free to talk to us about special solutions. Whether it's a TSSD^® for defining a distance to the component, a snap-fit TSSD^® for welding onto thin monolithic materials, a TSSD^® for the non-detachable joining of e.g. circuit boards or a TSSD^® for holding eccentric connectors, as is common in furniture construction. Please contact our experts for further advice.