EPPsys D
The reliable direct assembly in EPP foam
EJOT TSSD®
Specification
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Overview
- Fastening element and process specifically for sandwich elements
- Broad application range
- Especially suitable for honeycomb structures
- High transmittable tensile forces
- No corrosion
- Can be used as screw boss or as direct fastening element
Sebastian Schrodt
Head of Sales EJOWELD
CAD & more - Your Online-Service
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TSSD® Application Check *
Our Application Check allows you to make a general statement about the feasibility of your individual joining task.
CAD & more - Your Online Service Area
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For technical questions please contact our Hotline Team +49 2751 529-123
Problems with your access? Mail to: service-industrie@ejot.com
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For technical questions please contact our Hotline Team +49 2751 529-123
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For technical questions please contact our Hotline Team +49 2751 529-123
Problems with your access? Mail to: service-industrie@ejot.com
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For technical questions please contact our Hotline Team +49 2751 529-123
Problems with your access? Mail to: service-industrie@ejot.com
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For technical questions please contact our Hotline Team +49 2751 529-123
Problems with your access? Mail to: service-industrie@ejot.com
Can not process your request for CAD
Please contact our customer care
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For technical questions please contact our Hotline Team +49 2751 529-123
Problems with your access? Mail to: service-industrie@ejot.com
The EJOT TSSD® thermal adhesive bonding boss
The EJOT TSSD® (thermal adhesive bonding boss) product and corresponding joining process have been developed with the objective to join components of which one is made of fibre-reinforced plastics.
The process is suitable for sandwich elements with honeycomb and foam core structures (having different top coats) as well as for CRP and GRP plastic materials.
During the joining process the plastic boss (made of thermoplastic) is installed into the plastic component with a certain rotation speed and axial load.
TSSD® APPLICATION CHECK
For process reliable fastening of components in honeycomb and foam core structures with different cover layers, EJOT has developed the "TSSD" (thermal adhesive bonding boss), an innovative product including joining process. For the TSSD® joining process, a new online tool is now available, where the user can find standard values which are based on numerous trials.
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